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    MIAO Rong-li. Broken Reason Analysis of ZnS Window Edge of Infrared Device and Process Improvement[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2010, 46(1): 64-65.
    Citation: MIAO Rong-li. Broken Reason Analysis of ZnS Window Edge of Infrared Device and Process Improvement[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2010, 46(1): 64-65.
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    Broken Reason Analysis of ZnS Window Edge of Infrared Device and Process Improvement

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      • Abstract
    • The ZnS window edge of infrared device was broken. The broken reason was analyzed by means of macro and micro examination by scanning electronic microscope. The results showed that the fracture mode of the infrared device ZnS window was brittle fracture. The improvement measures were put forward.
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