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ZENG Wen-qi, HU Jian-guo. Quantitative Metallography Analysis of Heating Multi-thread Copper Wires[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2011, 47(12): 756-759.
Citation: ZENG Wen-qi, HU Jian-guo. Quantitative Metallography Analysis of Heating Multi-thread Copper Wires[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2011, 47(12): 756-759.

Quantitative Metallography Analysis of Heating Multi-thread Copper Wires

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  • Received Date: April 01, 2011
  • By applying heating box, metallographic microscope, the Image Pro-Plus image analysis software and other tools, the change and distribution rule of the grain area of multi-thread copper wires, which were heated under different thermal environment were studies. The results show that the grain area and its distribution were affected by the heating temperature, heating time and cooling ways in different ranges, within some rules of quantification. Through the quantitative metallography analysis of multi-thread copper wires, some references for the identification of material evidence for fire trace could be obtained.
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