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    CHEN Ping, LAI Kai-zhong, LI Yue-sheng, LI Shu-xue. FRACTURE ANALYSIS OF KINESCOPE SHRINK-BAND[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2008, 44(7): 385-388.
    Citation: CHEN Ping, LAI Kai-zhong, LI Yue-sheng, LI Shu-xue. FRACTURE ANALYSIS OF KINESCOPE SHRINK-BAND[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2008, 44(7): 385-388.
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    FRACTURE ANALYSIS OF KINESCOPE SHRINK-BAND

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    • The fracture analysis subjected to a kinescope shrink-band after mounting was investigated by means of metallographic examination,fracture analysis and hardness measurement. The coarse lath martensite grain caused during welding process was believed to responsible for the fracture of shrink-band. The fracture was a brittle fracture under stress.
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