Cracks Analysis on Soldered Joints of Non-standard Wave-guide Tubes

Means such as X-ray detection and scanning electronic microscope analysis were used to analyze the cracks formation reason on soldered joints of 90°wave-guide flanged bend of non-standard wave-guide tube. The results indicate that during manufacturing process of the wave-guide tube, a layer of oxidation film formed on the solder surface after wire cutting, and owing to incompletely cleaning out of the film, the solder could not be felted, which resulted in the not full soldering. Besides, during the soldering process, the orientation of the wave-guide tube was not precise and leaned to one side, which made the one side clearance too small and the solder could not be poured in completely, thus causing the problem that the solder could not penetrate and be filed out fully during soldering process. According to the cause of trouble, relevant improving measures had been taken, which was proved to meet with the using requirement after relevant demonstration experiment. The problem of cracks on soldered joints was solved.