GENG Xiang-ying, LI Shi-chun. A NEW METHOD OF INVESTIGATING THE KIRKENDALL EFFECT OF ATOMIC DIFFUSION AT Cu/Al INTERFACE[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2006, 42(6): 292-294.
Citation:
GENG Xiang-ying, LI Shi-chun. A NEW METHOD OF INVESTIGATING THE KIRKENDALL EFFECT OF ATOMIC DIFFUSION AT Cu/Al INTERFACE[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2006, 42(6): 292-294.
GENG Xiang-ying, LI Shi-chun. A NEW METHOD OF INVESTIGATING THE KIRKENDALL EFFECT OF ATOMIC DIFFUSION AT Cu/Al INTERFACE[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2006, 42(6): 292-294.
Citation:
GENG Xiang-ying, LI Shi-chun. A NEW METHOD OF INVESTIGATING THE KIRKENDALL EFFECT OF ATOMIC DIFFUSION AT Cu/Al INTERFACE[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2006, 42(6): 292-294.
A NEW METHOD OF INVESTIGATING THE KIRKENDALL EFFECT OF ATOMIC DIFFUSION AT Cu/Al INTERFACE
Cu-Al diffusion couples were prepared with mechanical method. The Kirkendall effect of atomic diffusion at Cu/Al interface was investigated by analyzing the changes of the diameters of pin and pinhole respectively during sintering with the help of the OPM and color metallograph. The results show that Cu diffused more into Al in the range of the sintering temperature.
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