Application of Scanning Electron Microscopy with Energy Dispersive Spectrometry in Failure Analysis of Electronic Packaging

The characteristics, sample preparation methods and working modes of scanning electron microscopy (SEM) and X-ray energy dispersive spectrometry (EDS) were introduced briefly. By some examples including copper corrosion, tin whisker, silver sulfide and silver migration, the applications of SEM with EDS in failure analysis of electronic packaging were discussed.