• 中国学术期刊(光盘版)全文收录期刊
  • 中国学术期刊综合评价数据库来源期刊
  • 中国期刊网、万方数据库入编期刊
  • 中文科技期刊数据库(全文版)收录期刊
  • 中国期刊全文数据库全文收录期刊
  • 中国机械工程学会 理化检验分会 失效分析分会 会刊
Advanced Search
CHEN Gang, CHEN Xu, BAI Ning, LI Xin. MECHANICAL CHARACTERIZATION OF 63Sn-37Pb AND Sn-0.7Cu SOLDERS[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2007, 43(6): 271-274.
Citation: CHEN Gang, CHEN Xu, BAI Ning, LI Xin. MECHANICAL CHARACTERIZATION OF 63Sn-37Pb AND Sn-0.7Cu SOLDERS[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2007, 43(6): 271-274.

MECHANICAL CHARACTERIZATION OF 63Sn-37Pb AND Sn-0.7Cu SOLDERS

More Information
  • The uniaxis tension and pure torsional tests in addition with torsional fatigue tests were conducted on 63Sn-37Pb and Sn-0.7Cu. The results show that the stress-strain relationship,yield stress,shear yield stress,tensile strength,shear strength of the solders have strong strain rate-dependence. But the elastic modulus and shear modulus do not have apparent strain rate dependent effect. The two solders belong to shear-type fracture materials,and the cyclic softening effect occurs under cyclic loading conditions.
  • [1]
    黄惠珍,魏秀琴,周 浪.无铅钎料及其可靠性的研究进展[J].电子元件与材料,2003,22(4):39-42.
    [2]
    Abtew M,Selvaduray G. Lead-free solders in microelectronics[J]. Materials Science and Engineering,2000,27:95-141.
    [3]
    ASTM E606-1998 Standard practice for strain-controlled fatigue testing[S].
    [4]
    李 鑫,陈 旭,白 宁,等.微型拉扭疲劳试验机及其控制系统[J].理化检验-物理分册,2006,42(1):45-47.
    [5]
    Pang H L J,Xiong B S,Low T H. Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy[J]. International Journal of Fatigue,2004,26:865-872.

Catalog

    Article views (4) PDF downloads (2) Cited by()

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return