CHARACTERISTIC OF INTERNAL STRESS AND TEXTURE IN ELECTROPLATED COPPER THIN FILMS

The characteristic of texture and internal stress of electroplated copper thin films were studied using X-ray diffraction (XRD) analysis. The results showed that the electroplated copper thin films had highly preferred orientations of (220). The (220) fiber-texture of copper thin films became strong with increasing internal stress. At a critical film thickness,the copper thin films exhibited character of planar texture.