NIE Rui-xia, SONG Chun-mei. Failure Analysis of Aluminum Corrosion of Hybrid Circuits[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2011, 47(3): 184-186.
Citation:
NIE Rui-xia, SONG Chun-mei. Failure Analysis of Aluminum Corrosion of Hybrid Circuits[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2011, 47(3): 184-186.
NIE Rui-xia, SONG Chun-mei. Failure Analysis of Aluminum Corrosion of Hybrid Circuits[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2011, 47(3): 184-186.
Citation:
NIE Rui-xia, SONG Chun-mei. Failure Analysis of Aluminum Corrosion of Hybrid Circuits[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2011, 47(3): 184-186.
Failure Analysis of Aluminum Corrosion of Hybrid Circuits
The bonding failure reason of hybrid circuit was analyzed by means of physical testing and chemical analysis and simulation experiment. The results showed that contamination and hydrosphere led to aluminum corrosion in production and manufacturing process of hybrid circuit. On the basis of the failure reason, the reasonable measures to control contamination and hydrosphere were put foward.
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