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NIE Rui-xia, SONG Chun-mei. Failure Analysis of Aluminum Corrosion of Hybrid Circuits[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2011, 47(3): 184-186.
Citation: NIE Rui-xia, SONG Chun-mei. Failure Analysis of Aluminum Corrosion of Hybrid Circuits[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2011, 47(3): 184-186.

Failure Analysis of Aluminum Corrosion of Hybrid Circuits

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  • Received Date: March 30, 2010
  • The bonding failure reason of hybrid circuit was analyzed by means of physical testing and chemical analysis and simulation experiment. The results showed that contamination and hydrosphere led to aluminum corrosion in production and manufacturing process of hybrid circuit. On the basis of the failure reason, the reasonable measures to control contamination and hydrosphere were put foward.
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    罗辑,赵和义.军用电子元器件质量管理与质量控制[M].北京:国防工业出版社,2004.
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    余振醒.军用元器件使用质量保证指南[M].北京:航空工业出版社,2003.

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