Effect of Additives on Properties of Styrene-butadien Rubber Based High Frequency Copper Clad Laminate

Using high content of vinyl styrene-butadiene rubber with three different structure of vinyl monomer (additives) as the resin matrix of copper clad laminate. The effects of different content styrene butadiene rubber on the properties of three different systems of copper clad laminates were studied. The results show that the dielectric properties of copper clad laminates with DVB system were the best, the minimum dielectric constant and dielectric loss were 3.33 and 0.002 4, respectively, and the minimum water absorption was 0.024%. The copper clad laminates with TAIC system had higher glass transition temperature up to 248 ℃, and bending strength up to 351 MPa.