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    WANG Shusen, ZHANG Yuanwang, YAO Dawei. Test Method of Softening Temperature of Cu-0.5Ag Alloy Microwire for Electronic Cables[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2020, 56(1): 18-20,31. DOI: 10.11973/lhjy-wl202001005
    Citation: WANG Shusen, ZHANG Yuanwang, YAO Dawei. Test Method of Softening Temperature of Cu-0.5Ag Alloy Microwire for Electronic Cables[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2020, 56(1): 18-20,31. DOI: 10.11973/lhjy-wl202001005

    Test Method of Softening Temperature of Cu-0.5Ag Alloy Microwire for Electronic Cables

    • At present, there is no clear standard for testing the softening temperature of copper alloy microwire at home and abroad. The softening temperature of Cu-0.5Ag alloy microwire for electronic cables was tested by tensile strength and hardness by tensile strength at room temperature and hardness test, and the test results were compared and analyzed. The results show that the softening temperatures of Cu-0.5Ag alloy microwire tested by tensile strength and hardness were similar; there were many uncertainties in testing the softening temperature of microwire tested by hardness, and the load, wire diameter size and test location had influence on the test results of softening temperature. It was more convenient and reliable to use tensile strength to test the softening temperature of copper alloy microwire for electronic cables.
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