Research on Curing Reaction Kinetics of Epoxy Resin/Hollow Glass Microspheres System by Non-isothermal DSC Method

The curing reaction process of epoxy resin/4,4'-diamino diphenyl methane (EP/DDM) system filled with hollow glass beads (HGB) was tracked by differential scanning calorimetry (DSC) method under non-isothermal condition. The kinetics parameters of the curing system were calculated and the curing process conditions were determined. The results indicate that the apparent activation energy of the EP/DDM/HGB system was 51.21 kJ ·mol^-1, and the reaction order was 0.91. In contrast with pure epoxy resin, the initial temperature of curing reaction for EP/DDM/HGB system was 7-12 ℃ lower, meanwhile the peak temperature of the curing reaction was 4-6 ℃ lower. And there was also a decline on the reaction enthalpy of EP/DDM/HGB curing system.