Citation: | FENG Hao, HU Li-fen, LIU Xin. Reasons Analysis on Corrosion of Au-plated Copper Contact Blocks[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2015, 51(10): 740-742. DOI: 10.11973/lhjy-wl201510016 |
[1] |
孔宪宝.电连接器可靠性设计[J]. 机电元件,1996(16): 32-39.
|
[2] |
SLADE P G. Electrical contacts principles and applications[M]. New York: New York Cutler Hammer Horseheads,1999: 15-20.
|
[3] |
LIANG Y N,ZHANG J G,LIU J J. Identification of inorganic compounds in dust collected in Beijing and their effects on electric contacts[C]// Proceedings 43rd IEEE Holm Conference on Electrical Contacts. Philadelphia: IEEE Press,1997: 315-327.
|
[4] |
ZHANG J G,LIANG Y N,WAN J W,et al.Analysis of organic compounds in airborne dust collected in Beijing[C]// Proceedings 44th IEEE Holm Conference on Electrical Contacts.Arlington: IEEE Press,1998: 166-171.
|
[5] |
GB/T 2423.3-2006电工电子产品环境试验 第2部分:试验方法 试验Cab:恒定湿热试验[S].
|
[6] |
GB/T 5231-2001加工铜及铜合金化学成分和产品形状[S].
|
[7] |
周怡琳.同轴连接器镀金层磨损分析方法的研究[J].电子学报,2006(10): 1852-1855.
|
[8] |
王海兰.磷酸三甲苯酯的职业危害与防护[J].现代职业安全,2013(12): 104-105.
|