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FENG Hao, HU Li-fen, LIU Xin. Reasons Analysis on Corrosion of Au-plated Copper Contact Blocks[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2015, 51(10): 740-742. DOI: 10.11973/lhjy-wl201510016
Citation: FENG Hao, HU Li-fen, LIU Xin. Reasons Analysis on Corrosion of Au-plated Copper Contact Blocks[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2015, 51(10): 740-742. DOI: 10.11973/lhjy-wl201510016

Reasons Analysis on Corrosion of Au-plated Copper Contact Blocks

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  • Received Date: July 02, 2014
  • For the corrosion phenomenon of a batch of battery pack connector Au-plated copper contact blocks during humid heat test, a variety of inspection and analysis on the material and manufacture design of the contact blocks were conducted. The results show the corrosion of the contact blocks was mainly because the surface plating quality was poor with local skip plating and insufficient thickness. Furthermore, the potential difference between the contact block and the anode accelerated the corrosion. Beside, the phosphoric acid released from the packaging gule under the environment of high temperature and high humidity, would also induce the corrosion of the contact blocks. Finally, a series of quality control suggestions of the contactor were proposed according to above reasons.
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