红外装置ZnS窗口崩边原因分析与工艺改进
Broken Reason Analysis of ZnS Window Edge of Infrared Device and Process Improvement
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摘要: 某型红外装置ZnS窗口出现崩边。采用扫描电镜对断口进行了宏观和微观检验,对ZnS窗口崩边的原因进行了分析。结果表明: ZnS窗口崩边是脆性断裂。并提出了工艺改进措施。Abstract: The ZnS window edge of infrared device was broken. The broken reason was analyzed by means of macro and micro examination by scanning electronic microscope. The results showed that the fracture mode of the infrared device ZnS window was brittle fracture. The improvement measures were put forward.