Abstract: The development process and research status of lead-free solder in electronic device were described, and through EDAX composition analysis of solder joints in the domestic electronic device, to study the actual application status of lead-free solder. It was showed that Sn-Pb solder was still used in the current domestic electronic devices as the main solder, but the lead content was decreased year by year. It can clearly be seen, lead-free solder have already started in the domestic electronic devices. However, to achieve complete lead-free there is still a long way to go.