陶瓷/金属封接残余应力的计算和测试
COMPUTATION AND MEASUREMENT OF RESIDUAL STRESSES IN CERAMICS/METAL JOINTING
-
摘要: 陶瓷/金属封接过程中容易产生残余应力,将影响到封接强度和产品的可靠性。应用薄壳理论和ANSYS有限元分析软件对典型结构的应力分布进行了计算,同时应用X射线衍射法对该结构的应力进行了测试。结果表明,计算值和测量值的趋势基本一致,都是在陶瓷侧的外表面靠近界面的地方存在着最大的轴向拉应力。Abstract: The residual stress is easily produced in ceramic/metal jointing and it will affect the intensity of jointing and the reliability of products. The distribution of residual stress in typical configuration is calculated by using theoretical formulae and ANSYS. In the same time it is measured by X-ray diffraction. The results show that the stress distributions obtained by computations and X-ray stress measurement have the same changing trends and the highest tensile stress occurs at the outer surfaces of the ceramic near the welding interfaces.