Abstract: Copper wire melt marks samples were prepared using electrolytic polishing method, and the existence status of melt marks texture in different types of copper wires was analyzed using backscattered electron diffraction analysis technology. The results show that there was a significant difference in the texture state between flame melt marks and short-circuit melt marks. The flame melt marks had almost no texture in any direction, and the microstructure was mainly coarse equiaxed crystals. Both primary and secondary short circuit melt marks had obvious textures, and the edges of secondary short circuit melt marks were prone to coarse equiaxed or dendritic crystals, while the edges of primary short circuit melt marks were mainly distributed as columnar crystals.