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    无氧铜电子束焊接接头的显微组织及力学性能

    Microstructure and Mechanical Properties of Oxygen-Free Copper Electron Beam Welding Joints

    • 摘要: 以40 mm厚的无氧铜板材作为研究对象,选取适当的工艺参数进行电子束焊接,对母材和焊接接头的显微组织及力学性能进行了对比分析。结果表明:无氧铜板经电子束焊接后,焊接接头无明显表面缺陷,焊缝区域狭窄呈钉形,显微组织为铸态等轴晶粒,焊接接头性能良好,其硬度、抗拉强度及塑性均与母材的相当。

       

      Abstract: The 40 mm thick OFC plates as the research object welded by electron beam welding with appropriate process parameters. Microstructure and mechanical properties of OFC welding joints were compared with base material. The results show that the welding joint has no apparent surface defects, the weld zone nailed and the microstructure as cast equiaxed crystal grain after the electron beam welding of OFC. The welding joint has good performance, and its hardness, tensile strength and plasticity were equal to that of the base material.

       

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